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English to Chinese: Sample_Chemistry_en-US to zh-CN General field: Science Detailed field: Chemistry; Chem Sci/Eng
Source text - English Technical guidelines
The information published here is given in good faith and is based upon our experience to date when processing Eastman Naia™ cellulosic yarn. However, these recommendations should be regarded as guidelines only, and it is the responsibility of the user to test the suitability of processes or products for a specific application.
1. Maintain optimal knitting conditions.
• Knitting atmospheric conditions should be 60-65 percent relative humidity and 18-21 °C.
• Naia cellulosic yarn should be conditioned 24 hours in prior to knitting to achieve the best results.
2. Protect yarn packages* during storage and handling to avoid breaking filaments.
• Naia yarn packages should be stored and handled in an upright position. For detailed information on storage, refer to your product’s technical data sheet.
• Cases should be opened carefully, not cutting the case with sharp objects.
• For cardboard case yarn, the plastic bags on yarn packages are best removed by splitting down the bag seam as opposed to rapidly pulling the plastic bag off the end of the yarn package.
• When taking a Naia cellulosic yarn package out of the case and placing it on the creel, minimize touching the yarn surface with bare fingers or nails. We recommend wearing soft cotton gloves during handling. Naia yarn packages should be handled carefully so filaments do no break and edges of the yarn package do not roll.
• Any sloughed, disturbed, or damaged yarn encountered in unpacking or creeling of yarn packages should be removed by air doffing or reeling off before placing yarn into processing.
Translation - English Detailed Explanation on Baluns for Highly Integrated RF Modules
Nowadays, to meet the growing demands for higher levels of system integration, RF/MMIC engineers designing multi-chip modules need to perform “circuit-level” electromagnetic simulation and modeling. In addition to typical active components, modules providing full system-level functionality require passive support circuits. These passive components typically include the following circuits: 90-degree couplers, 180-degree couplers, in-phase couplers, filters, diplexers, and transmission line structures.
Baluns are very important support circuits used in high-frequency circuit design. The 180-degree balun is a major component in heterojunction bipolar transistor (HBT) as well as pseudo high-electron mobility transistor (pHEMT) push-pull amplifiers, balanced mixers, balanced frequency multipliers, phase shifters, balanced modulators, dipole feeds, unbalanced to differential converters for differential signaling, and numerous other applications. Moreover, analog circuits benefitting from balanced inputs and outputs to reduce noise, minimize high-order harmonics, and enhance dynamic range are also well-suited for this type of balun structure.
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