Glossary entry (derived from question below)
Jan 29, 2007 20:03
17 yrs ago
English term
voiding
English to German
Tech/Engineering
Metallurgy / Casting
Lötpaste
Es geht um eine Lötpaste
Features
• Ultra-low voiding in BGA/CSP components
•Ultra-low voiding at via-in-pad sites
• Excellent micro BGA/CSP printability
•Wide reflow process window
•Good response-to-pause performance
Features
• Ultra-low voiding in BGA/CSP components
•Ultra-low voiding at via-in-pad sites
• Excellent micro BGA/CSP printability
•Wide reflow process window
•Good response-to-pause performance
Proposed translations
(German)
4 | Lücken | jccantrell |
Proposed translations
35 mins
Selected
Lücken
Just means that when the solder flows under the BGA, it will not leave holes where there is NO solder but there is supposed to be.
4 KudoZ points awarded for this answer.
Comment: "Danke!"
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